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Design of Memory Hierarchies MCQ (Multiple Choice Questions) PDF Download
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The MCQ: To the server 90% of accesses are local, 9% are being outside the server but in the rack, and 1% are being outside the rack will be having average memory latency of; "Design of Memory Hierarchies" App Download (Free) with answers: 12.09 microseconds; 12.09 nanoseconds; 11.09 microseconds; 11.09 nanoseconds; for online software engineering classes. Practice Design of Memory Hierarchies Quiz Questions, download Apple eBook (Free Sample) for cheapest online computer science degree.
Design of Memory Hierarchies MCQs: Questions and Answers PDF Download
if ($s2 < $s3) $s1 = 1; else $s1 = 0 in assembly language can be written as
- sll $s1,$s2,$s3
- slt $s1,$s2,$s5
- sll $s1,$s2,$s4
- slt $s1,$s2,$s3
To the server 90% of accesses are local, 9% are being outside the server but in the rack, and 1% are being outside the rack will be having average memory latency of
- 12.09 microseconds
- 12.09 nanoseconds
- 11.09 microseconds
- 11.09 nanoseconds
A common optimization for reducing write stalls is a
- write buffer
- write-back
- read stall
- write stall
The final stage of completion of an instruction, after which merely the result remains, is known
- write result
- read result
- execute
- commit
Pipeline having stalls are required only a single time per vector instruction, instead of once per
- vector register
- vector element
- chaining
- line prediction
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Operating System Practice Questions
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Operating System MCQ Questions
- NUMA related to computers, is an abbreviation of
- Configuration manager responsible for implementing and managing
- MAC operating system is an abbreviation of
- Jobs of computer system for execution are loaded into
- All jobs of OS are not kept in main memory due to its small size so they resides on disks of
Design of Memory Hierarchies MCQs Book Questions
- A remote node is being node which has a copy of a
- Redundant array, that is known as mirroring or shadowing is
- Drawback of building a large memory with DRAM is
- No of dies/300 mm or (30 cm) wafer for die which is 1.5 cm on a side and for that die which is 1.0 cm on a side, would be
- Instruction, Add Loc,R1 in RTN is