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MCQ: 395

The no of dies/wafer is approximately the area of wafer which is divided by the area of this die. It is estimated by

  1. (? (wafer diameter/2)2\die area) + (? x wafer diameter\(2 x die area)^1\2)
  2. (? (wafer diameter/2)2\die area)-(? x wafer diameter\(2 x die area)^1\2)
  3. (? (wafer diameter/2)2\die area)*(? x wafer diameter\(2 x die area)^1\2)
  4. (? (wafer diameter/2)2\die area)\(? x wafer diameter\(2 x die area)^1\2)
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